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7387 is a one-component, low-viscosity CSP/BGA underfill adhesive. After curing, this material provides excellent protection for welded components in equipment against mechanical and thermal stresses such as impacts, drops, and vibrations.
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71173 is a one-component epoxy adhesive designed to provide uniform, void-free underfill encapsulation, maximizing device temperature cycling tolerance and dispersing stress away from solder joints, thereby significantly improving solder joint reliability in chip-scale packages (CSPs) and ball grid array packages (BGAs).
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7386-1 is a one-component, low-viscosity CSP/BGA underfill adhesive. After curing, this material provides excellent protection for welded parts in equipment when subjected to mechanical and thermal stresses such as impacts, drops, and vibrations.
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7386-2 is a one-component, low-viscosity, repairable CSP/BGA underfill adhesive. After curing, this material provides excellent protection for welded components in equipment against mechanical and thermal stresses such as impacts, drops, and vibrations.
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7386 is a one-component, low-viscosity, repairable CSP/BGA underfill adhesive. After curing, this material provides excellent protection for welded components in equipment against mechanical and thermal stresses such as impacts, drops, and vibrations.
learn more
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Tel:0755-29604659
Web:www.mosonbond.com
E-mail:moson@mosonbond.com
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Address: 5th Floor, Building C, No. 76, Dasha Road, Dalingshan Town, Dongguan City, Guangdong Province
Address: 2nd Floor, Building 1, No. 112, West District, Ma'anshan Community, Shajing Street, Bao'an District, Shenzhen
Address: Room 2806B, Building 2, Vanke Xingcheng Commercial Center, Shangxing Road, Shangxing Community, Xinqiao Street, Bao'an District, Shenzhen
