Welcome to the MOSON website
| BGA Chip Underfill | EP7382 EP200907-1 EP7386 |
QFN Chip Small Component Encapsulation | EP7382 EP200907-1 EP7386 EP7452 7329L 191103-1 |
UV6108-3 Black UV180827-1 UV13523 UV6320 | |
| Module Board | Full Encapsulation Adhesive 7329R-1 9000-12 230513-3 200923-16 9000EN |
Half Encapsulation: Epoxy Thermosetting Adhesive 7329R UV Moisture-Curable 9100-2F UV Adhesive: Black 180827-1 Black 6109-2B Transparent 6108-3 Milky White 230327-1 Amber 13523 Dark Blue 220718-9 Transparent UV240416-3 UV6320 | |
| Shield Can Bonding | Low-Temperature Thermosetting Adhesive: 7329D2 Milky White 250512-7 7383 |
| FPC Solder Joint Protection | UV241111-1 |
| Single Component Coating | UV Moisture-Curable 240430-21 |
| Chip Four-Side Encapsulation | UV Moisture-Curable 9100-2F (with Fluorescence) |
| Chip Four-Corner Bonding Adhesive | Epoxy Thermosetting Adhesive 74516A |
| FR4 Filling | Low-Temperature Thermosetting Adhesive: 7329 |
| Mobile Phone Side Buttons | EP7382 EP7386 EP191103-1 UV220628-5 UV220628-6 |
| Chip Anti-Tamper Adhesive | 74516A |
Tel:0755-27383451
Tel:0755-29604659
Web:www.mosonbond.com
E-mail:moson@mosonbond.com
Add:2nd Floor, Building 1, No. 112, West District, Ma'anshan Community, Shajing Subdistrict, Bao'an District, Shenzhen
...2026 Copyright MOSON® 粤ICP备2026014052号
Address: 5th Floor, Building C, No. 76, Dasha Road, Dalingshan Town, Dongguan City, Guangdong Province
Address: 2nd Floor, Building 1, No. 112, West District, Ma'anshan Community, Shajing Street, Bao'an District, Shenzhen
Address: Room 2806B, Building 2, Vanke Xingcheng Commercial Center, Shangxing Road, Shangxing Community, Xinqiao Street, Bao'an District, Shenzhen
