Bottom filler 71173

所属分类:Bottom filler glue

71173 is a one-component epoxy adhesive designed to provide uniform, void-free underfill encapsulation, maximizing device temperature cycling tolerance and dispersing stress away from solder joints, thereby significantly improving solder joint reliability in chip-scale packages (CSPs) and ball grid array packages (BGAs).

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Model

71173

Color

Black

Hardness (HD)

88±5

Viscosity (mPa·s)

13,300±2,000

Density (g/cm³)

1.65±0.02

Volume Shrinkage (%)

< 2

Glass Transition Temperature Tg (℃)

161

Water Absorption (%)

< 1

Shear Strength (MPa)

> 5

Curing Condition

150℃ for 5–10 min

Storage

-40℃ to -20℃

Typical Applications

Chip underfill / Low CTE / Especially for automotive chips, AI chips, etc.

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