Bottom filler 7386-2

所属分类:Bottom filler glue

7386-2 is a one-component, low-viscosity, repairable CSP/BGA underfill adhesive. After curing, this material provides excellent protection for welded components in equipment against mechanical and thermal stresses such as impacts, drops, and vibrations.

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Model

7386-2

Color

Black

Hardness (HD)

85±5

Viscosity (mPa·s)

2700±500

Density (g/cm³)

1.14±0.02

Volume Shrinkage (%)

< 4

Glass Transition Temperature Tg (℃)

110

Water Absorption (%)

< 1

Shear Strength (MPa)

> 10

Curing Condition

120℃ for 20 min

Storage

2℃ to 8℃

Typical Applications

Chip underfill / Repairable

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