Bottom filler 7386-1

所属分类:Bottom filler glue

7386-1 is a one-component, low-viscosity CSP/BGA underfill adhesive. After curing, this material provides excellent protection for welded parts in equipment when subjected to mechanical and thermal stresses such as impacts, drops, and vibrations.

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Model

7386-1

Color

Black

Hardness (HD)

85±5

Viscosity (mPa·s)

800±300

Density (g/cm³)

1.14±0.02

Volume Shrinkage (%)

< 4

Glass Transition Temperature Tg (℃)

110

Water Absorption (%)

< 1

Shear Strength (MPa)

> 8

Curing Condition

120℃ for 20 min

Storage

2℃ to 8℃

Typical Applications

Chip underfill / Repairable

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