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Adhesive Solutions for Mobile Phone Camera Modules

  • 分类:Industry
  • 作者:曼森
  • 发布时间:2026-01-27
  • 访问量:0
CSP ProcessFixing of Lens Holder and FPC

7329C-1

7329

7329C

7329D2

Thread Fixing of Lens and Lens Holder

UV6201

UV240906-9

UV191121-2

Chip Reinforcement & Protection

EP7386

EP201020-1

EP7382

EP200709-1

COM ProcessFixing of Lens Holder and Bracket

7329

7329C

7329D2

7329D2-1

Thread Fixing of Lens and Lens Holder

UV6201

UV240906-9

Bonding of Chip Bracket and FPC7328C
COB ProcessFixing of Lens Holder and Bracket

7329C-1

7329D2

7329

7329C

Fixing of Lens and Lens Holder

6201

Bonding of Chip Bracket and FPC7329C
Chip BondingRed Adhesive 240731-2
PLCC Process (Reflow Soldering Required)Fixing of Lens Holder and Bracket

7329C-1

7329D2

7329

7329C

Bonding of Chip Bracket and FPCBlack Adhesive 240807-1
AA Process

Base to Bracket Bonding

Bracket to PCB Bonding

Motor to Lens Bonding

AA7700

Vent Hole Sealing

UV6202

RTV8008B24


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