Bottom filler glue 7386

Category:Bottom filler glue

7386 is a one-component, low-viscosity, repairable CSP/BGA underfill adhesive. After curing, this material provides excellent protection for welded components in equipment against mechanical and thermal stresses such as impacts, drops, and vibrations.

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Product Details

Model

7386

Color

Black

Hardness (HD)

85±5

Viscosity (mPa·s)

1400±500

Density (g/cm³)

1.14±0.02

Volume Shrinkage (%)

< 4

Glass Transition Temperature Tg (℃)

110

Water Absorption (%)

< 1

Shear Strength (MPa)

> 8

Curing Condition

120℃ for 20 min

Storage

2℃ to 8℃

Typical Applications

Chip underfill / Repairable

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Tel:0755-27383451

Tel:0755-29604659

Web:www.mosonbond.com

E-mail:moson@mosonbond.com

Add:2nd Floor, Building 1, No. 112, West District, Ma'anshan Community, Shajing Subdistrict, Bao'an District, Shenzhen

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