9100-2F is a one-component, highly thixotropic UV/moisture dual-curing adhesive. This product rapidly cures upon exposure to sufficiently strong UV/or visible light to form a tough, translucent adhesive layer, and also cures in the shade. It is primarily used for localized protection of WLCSP and BGA circuit boards. This product fluoresces when observed under UV light.
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9100-1 is a one-component, highly thixotropic UV/moisture dual-curing adhesive. This product rapidly cures upon exposure to sufficiently strong UV/or visible light to form a tough, translucent adhesive layer, and also cures in the shade. It is primarily used for localized protection of WLCSP and BGA circuit boards. This product fluoresces when observed under UV light.
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9100-2 is a one-component, highly thixotropic UV/moisture dual-curing adhesive. This product rapidly cures upon exposure to sufficiently strong UV/or visible light to form a tough, translucent adhesive layer, and also cures in the shade. It is primarily used for localized protection of WLCSP and BGA circuit boards. This product fluoresces when observed under UV light.
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This is a single-component UV and moisture-curing adhesive, primarily composed of imported UV and moisture-curing resins, activators, photoinitiators, and various additives. After curing, it forms a transparent, dense, and smooth protective film, exhibiting superior resistance to high and low temperatures, insulation, moisture resistance, leakage prevention, shock resistance, dust resistance, corrosion resistance, mildew resistance, and sulfurization resistance on PCB boards. It is environmentally friendly, safe, 100% solids content, and offers advantages such as ease of use and simple operation.
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