UV moisture-curing adhesive 9100

Category:UV Moisture

9100-2F is a one-component, highly thixotropic UV/moisture dual-curing adhesive. This product rapidly cures upon exposure to sufficiently strong UV/or visible light to form a tough, translucent adhesive layer, and also cures in the shade. It is primarily used for localized protection of WLCSP and BGA circuit boards. This product fluoresces when observed under UV light.

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Product Details

Model

9100

Color

Light green / Fluorescent

Hardness (HD)

76±5

Viscosity (mPa·s)

8000–18000

Density (g/cm³)

1.05±0.02

Glass Transition Temperature Tg (℃)

Curing Condition

Mercury lamp 20s, room temperature

Storage

2–8℃

Typical Applications

FPC module board / Electronic component protection / Deep moisture curing applications, etc.

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Tel:0755-27383451

Tel:0755-29604659

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E-mail:moson@mosonbond.com

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