UV moisture-curing adhesive 9100-1

所属分类:UV Moisture

9100-1 is a one-component, highly thixotropic UV/moisture dual-curing adhesive. This product rapidly cures upon exposure to sufficiently strong UV/or visible light to form a tough, translucent adhesive layer, and also cures in the shade. It is primarily used for localized protection of WLCSP and BGA circuit boards. This product fluoresces when observed under UV light.

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Model

9100-1

Color

Fluorescent

Hardness (HD)

70±5

Viscosity (mPa·s)

6000–15000

Density (g/cm³)

1.03±0.02

Glass Transition Temperature Tg (℃)

Curing Condition

Mercury lamp 20s, room temperature

Storage

2–8℃

Typical Applications

FPC / Single component encapsulation

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