7329C is a multi-purpose, one-component, low-temperature thermosetting, high-strength liquid epoxy adhesive.This product can achieve high-strength bonding on various materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics and other materials.It is especially suitable for bonding heat-sensitive substrates that require low-temperature curing.It is ideal for electronic component assembly and industrial applications requiring structural bonding.
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7329 is a multi-purpose, one-component, low-temperature thermosetting, high-strength liquid epoxy adhesive.This product can achieve high-strength bonding on various materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics and other materials.It is especially suitable for bonding heat-sensitive substrates requiring low-temperature curing.It is ideal for electronic component assembly and industrial applications requiring structural adhesive bonding.
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Low-temperature thermosetting adhesives specifically refer to thermosetting adhesives that undergo cross-linking reactions upon heating at ≤100°C to form a three-dimensional network structure.They are mainly based on one-component epoxy systems, and formula optimization enables low-temperature and rapid curing, avoiding thermal damage to substrates.During curing, the resin reacts with latent curing agents at the set temperature, achieving stable bonding strength within a short time.
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7329D2 is a one-component, low-temperature thermosetting paste epoxy adhesive.This product can achieve high-strength bonding on various materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics and other materials.It is suitable for bonding heat-sensitive substrates that require low-temperature curing.This product features high thixotropy, easy shaping, and good toughness after curing.
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7329W is a multi-purpose, one-component, low-temperature thermosetting, high-strength liquid epoxy adhesive.This product can achieve high-strength bonding on various materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics and other materials.It is especially suitable for bonding heat-sensitive substrates that require low-temperature curing.It is ideal for electronic component assembly and industrial applications requiring structural bonding.
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10E65 Conductive Silver Paste This silver paste is designed for printing on LED components and EL electroluminescent sheets. Excellent electrical and physical properties can be achieved after curing at 120–160℃ for 30–40 minutes. It features good printability, electrical conductivity, solderability and oxidation resistance.
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10E901 Conductive Silver Paint is a one-component, air-drying conductive coating.It mainly consists of thermoplastic adhesive, silver powder and solvent.This product features low viscosity, excellent sprayability, good leveling and conductivity after baking.It exhibits outstanding adhesion to PET, metal, glass, ceramic and other substrates.
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56649 is a reactive, translucent polyurethane hot melt adhesive that cures with moisture from air.It is used for structural bonding of housings requiring fast fixturing, such as mobile phones, laptops, smart wearable devices, etc.
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