Low-Temperature Thermosetting Adhesive 7329G

Low-temperature thermosetting adhesives specifically refer to thermosetting adhesives that undergo cross-linking reactions upon heating at ≤100°C to form a three-dimensional network structure.They are mainly based on one-component epoxy systems, and formula optimization enables low-temperature and rapid curing, avoiding thermal damage to substrates.During curing, the resin reacts with latent curing agents at the set temperature, achieving stable bonding strength within a short time.