Low-Temperature Thermosetting Adhesive 7329D2

所属分类:Low-temperature thermosetting adhesives

7329D2 is a one-component, low-temperature thermosetting paste epoxy adhesive.This product can achieve high-strength bonding on various materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics and other materials.It is suitable for bonding heat-sensitive substrates that require low-temperature curing.This product features high thixotropy, easy shaping, and good toughness after curing.

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Model

7329D2

Color

Black

Hardness (HD)

45±5

Viscosity (mPa·s)

20,000±10,000

Density (g/cm³)

1.18±0.02

Volume Shrinkage (%)

<4.5

Glass Transition Temperature Tg (℃)

Water Absorption (%)

Shear Strength (MPa)

>10

Curing Condition

75℃ for 20 minutes

Storage Condition

-20℃ to -15℃

Typical Applications

Mobile phone camera module / Electronic component fixing / Electrical motors / Consumer electronics, etc.

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