AA process adhesive for mobile phone cameras_MOSON Technology - Adhesives for LCDs and Touchscreens - Adhesives for Lenses and Optics - Low-Temperature Thermosetting Adhesives - Shenzhen Manson Adhesive Technology Co., Ltd.

7329D2 Adhesive for Mobile Phone Camera Module Base

7329D2 is a one-component, low-temperature thermosetting paste epoxy adhesive. This product can provide high-strength bonding to a variety of materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics, and others. It is suitable for bonding heat-sensitive substrates that require low-temperature curing. This product has high thixotropy, is easy to shape, and exhibits good toughness after curing.

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Mobile phone camera module thread fixing adhesive 6201-1

6201-1 is a one-component, UV-curable, acrylic adhesive. This product offers excellent bonding performance for PC, LCP, ABS, and nylon+glass fiber materials, as well as for protecting PCB components, IC components, FPC, ribbon cables, and solder joints. It features strong adhesion, toughness, and high shock resistance.

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AA process adhesive for mobile phone cameras AA7700-1

The AA process for mobile phone cameras is a core packaging technology that dynamically adjusts the position of components such as lenses and sensors through real-time image feedback to achieve sub-micron level optical alignment. It uses second-level UV pre-curing to lock in micron-level precision and low-temperature thermal curing to achieve durability. It also takes into account high bonding strength, low shrinkage and excellent environmental resistance. It is the core material for assembling lenses-mounts, VCM motors and sensors in mobile phone camera modules.

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7329C Adhesive for Mobile Phone Camera Module Bracket

7329C is a multi-purpose, one-component, low-temperature thermosetting, high-strength liquid epoxy adhesive. This product can provide high-strength bonds to a variety of materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics, and others. It is particularly suitable for bonding heat-sensitive substrates that require low-temperature curing. It is suitable for electronic component assembly and industrial applications requiring structural adhesives.

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74519R COB chip package for mobile phone cameras

74519R is a multi-purpose, one-component, thermosetting, high-strength liquid epoxy adhesive. This product provides high-strength bonding to a variety of materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics, and others. It is particularly suitable for COB (Choose-O-Body) bonding.