7329D2 Adhesive for Mobile Phone Camera Module Base

所属分类:AA process adhesive for mobile phone cameras

7329D2 is a one-component, low-temperature thermosetting paste epoxy adhesive. This product can provide high-strength bonding to a variety of materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics, and others. It is suitable for bonding heat-sensitive substrates that require low-temperature curing. This product has high thixotropy, is easy to shape, and exhibits good toughness after curing.

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Model

7329D2

Color

Black

Hardness (HD)

45±5

Viscosity (mPa·s)

20,000±10,000

Density (g/cm³)

1.18±0.02

Volume Shrinkage (%)

< 4.5

Glass Transition Temperature Tg (℃)

Water Absorption (%)

< 2

Shear Strength (MPa)

> 10

Curing Condition

75℃ for 20 min

Storage

-20℃ to -15℃

Typical Applications

Mobile phone camera / IR bracket / Base bonding

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